PCB / FPCB
PCB / FPCB
- Removal of photoresist residue
- Removal of carbon
- Activation of teflon
- Reduction of oxidution (Cu, Ag)
- Pre-treatment for DFR film Laminating
- Pretreatment TAB bonding
- Pre treatment of PET (PI) film for electroless Cu plating
Application example
Plasma surface treatment to prevent heat-oxidation of Cu
Plasma surface treatment can prevent heat oxidation of copper surface, thus enhancing the product quality and stabilizing the process.
Plasma surface treatment and metal plates
Plasma surface treatments on various types of metal plates used for PCB/FPCB processes lead to better plating/bonding results.