Other applications
- LED Packge
- For injection molding
- Resin/leadframe adhesion
- Pretreatment for die attach
- Pretreatment for wire bonding
- For molding
- For glue removal
- Semiconductor
- Wafer Cleaning
- Initial cleaning
- PR removal
- Pretreatment plating
- Screen printing for die attach
- Oxide layer removal
- Organic removal
- Solder ball Cleaning
- Wire bonding
- Au bumping
- ACF bonding
- Bio
- Petridish treatment
- Biochip bonding (PDMS, Plastic, glass)
- Pretreatment glucose dispensing
- Cell culture treatment
- Sterilization
- Hydrophilic / Hydrophobic coating
- Super hydrophilic / Super hydrophobic coating
Application example
Atmospheric plasma and PR-ashing of wafers
Atmospheric plasma can remove photoresisters. This process can be integrated into the overall in-line processes.
Atmospheric plasma and hydrophobic coating
Hydrophobic coating treatment has been done onto a wafer through an in-line atmospheric plasma.
Hydrophobic patterning with plasma
Patterns can be formed using the hydrophobic coating technology with plasma.
Reduction of oxidated film of lead frame by plasma application
Atmospheric plasma can be applied to an oxidated lead frame. The plasma will reduce the oxidated film on the surface. Oxidated lead frames can thus be restored and recycled, thus increasing overall yield.
Hydrophilic surface treatment of blood sugar strip sheets
Blood sugar strip sheets can be treated with plasma so that the surfaces turn hydrophilic, enhancing printability of enzymes.