Mobile
TSP/Smart phone/Smart pad
- Before
- Laminationg : OCA film, DAT film
- Optical Bonding : LOCA, Super view resin
- COG,COF bonding(ACF)– TAB bonding
- Printing of Black Matrix
- Slit coating of photoresist
- AF spray coating
- AR spray coating
- Painting of phonecase
- Dotting of spacer
- DFR Lamination
- Residue removal of Photoresist
Application example
Removal of air bubbles in touch-cell lamination process
The OCA/LOCA lamination process in the TSP manufacturing can cause air bubbles to form between the window and the film/glass. Plasma treatment aims to remove/suppress the air bubble formations.
Enhancing ACF bonding strength
Surface treatment on the ACF bonding part of a touch cell using plasma enhances the bonding strength, thus improving reliability.
Pretreatment prior to anti-fingerprint coating on cover windows
Anti-fingerprint coating aims to prevent contaminations from the user’s fingerprints on the cover windows of smartphone and PADs.
Rework of anti-fingerprint coating
Anti-fingerprint coating process sometimes causes the problem of so-called back-coating effect, which means the backside of the coating surface gets contaminated with overflown coating liquid.