FPD
OLED/Flexible display
- Initial glass cleaning- COG,COF bonding(ACF)
- ITO Cleaning
- Organic dust removal
- Improve of Blue OLED efficiency
- Pretreatment seal dispensing
- Pretreatment TAB bonding
- Moisture removal
- PI Film cleaning & activation
LCD
- TFT process : Pre-deposition, Pre-Photolithography, pre-etching
- Color filter process : Pre-deposition, Pre-Photolithography
- Cell process : Pre-Pl printing
- Module process : ACF Bonding
- Initial Cleaning – Cleaning before Photo process
- PR Ashing – Cleaning before BM & RGB process
- RGB ashing – Cleaning before PI ink-jetting
- Cleaning before BM process – Cleaning before Wet etching process
- Cleaning before etch process – Pre Cleaning before COG bonding
- Cleaning before CVD, Sputterterilization – Pre-treatment for RGB Ink-jetting
Application example
Whole glass cleaning( 8G ~10G )
Traditional N2 plasma and eximer UV process for dry surface treatments, was replaced with argon direct plasma.
Ashing on photoresistor using plasma
Removal of PR was done using plasma. This means the old wet type process was replaced by dry type.
Enhancing surface of PI film using plasma
Enhanced lamination through surface enhancement of PI film
Surface enhancement of ITO film/glass using plasma
Enhanced lamination through surface enhancement of ITO film/glass